Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.
Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. - Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors- Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science- Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems
Our site uses cookies and similar technologies to offer you a better experience. We use analytical cookies (our own and third party) to understand and improve your browsing experience, and advertising cookies (our own and third party) to send you advertisements in line with your preferences. To modify or opt-out of the use of some or all of our cookies, please go to “Manage Cookies” or view our Cookie Policy to find out more. By clicking “Accept all” you consent to the use of these cookies.